Job Description

  • Oversee manufacturing operations to ensure seamless production flow, yield improvement, and quality assurance in assembly lines.
  • Drive continuous improvement projects targeting cost reduction, cycle time optimization, and defect elimination. 
  • Lead process development by designing, validating, and optimizing automated wire bond and packaging programs, parameters, and specifications.
  • Establish materials engineering and statistical monitoring systems to ensure reliability, consistency, and compliance with industry standards.
  • Provide problem-solving and ramp support through data analytics, systemic issue resolution, and equipment startup for new technologies and experiments. 

Job Requirements

  • Education: Bachelor's degree in engineering or related field; postgraduate qualification is an advantage.
  • Experience: Min 10 years of experience in semiconductor assembly, packaging, or manufacturing engineering.
  • Leadership: Solid experience in process engineering and team management, with a strong track record in analysis, problem solving, and performance improvement. 
  • Skills: Exposure to automation, AI, or digital transformation initiatives is an added advantage.