Job Description
- Support manufacturing operations and ensure smooth production processes.
- Develop and implement improvements in manufacturing methods, procedures, and efficiencies.
- Create automated wire bond programs and optimize wedge bonding parameters.
- Manage wire bond processes for customer deliverables.
- Document process details in specifications and work instructions.
- Define wire bond materials for specific applications (wire type, capillary, etc.).
- Establish statistical monitoring methods to support process control.
- Implement improvement projects including efficiency, cost reduction, and quality programs.
- Identify and resolve process issues related to equipment or procedures.
- Support manufacturing ramp-up with equipment startup and process experiments.
- Conduct data analysis and contribute to problem resolution.
Job Requirements
- Minimum 5 years of wirebond semiconductor experience.
- Hands-on knowledge of KNS or ASM wirebond processes.
- Bachelor’s degree in Engineering or related fields (Chemical, Electrical, Mechanical, Materials Science, Physics, etc.).
- Strong foundation in statistical process control, engineering change control, and process release strategies.
