Job Description

  • Ensure smooth operations while improving efficiency, output, machine performance, and product quality.
  • Define materials such as flux, solder paste, and bumps, and document processes in specifications and work instructions.
  • Develop formulas and oversee production monitoring for flip-chip devices. 
  • Design and implement advanced chip adhesion methods, automated programs, and standardized recipes. 
  • Establish statistical and automated monitoring systems to support the chip bonding process.
  • Support equipment and process startups, and conduct tests during production ramp-up. 

Job Requirements

  • Bachelor's degree in chemical, electrical, mechanical, materials science engineering, physics, chemistry, or related field.
  • Min 5 years of experiences in flip chip process; prior experience with flip-chip mounting, reflow soldering, and flux cleaning would be extra plus.
  • Skill: Familiarity with Excel, Minitab, Spotfire, JMP, and quality tools such as FTA, Fishbone, 8D, RCA, DMAIC.