Job Description

  • Ensure smooth production while driving efficiency, output, machine performance, and product quality. 
  • Design and implement advanced wire bond programs, optimize parameters, and standardize recipes for wedge bonding.
  • Support wire bond processes for customer materials, ensuring compliance with flip-chip package requirements.
  • Establish statistical and automated monitoring systems to ensure process stability and reliability.  
  • Define wire bond materials such as wire type and capillary parts and document processes in specifications and work instructions.
  • Support equipment and process startups and conduct experiments during manufacturing ramp-up.

Job Requirements

  • Bachelor's degree in chemical, electrical, mechanical, materials science engineering, physics, chemistry, or related field.
  • Min 5 years in wire bond semiconductor processes; proven ability to work effectively in fast-paced, rapidly changing environments.
  • Skill: Hands-on experience with KNS or ASM wire bond equipment.
  • Strong foundation in statistical process control, engineering change control, and process release strategies.