Job Description

  • Manage wire bond equipment operations to ensure seamless production flow, yield improvement, and quality assurance. 
  • Drive equipment optimization projects targeting cost reduction, cycle time improvement, and defect elimination. 
  • Lead process and equipment development by validating, upgrading, and optimizing wire bond programs and specifications.
  • Establish preventive maintenance and statistical monitoring systems to ensure reliability, consistency, and compliance with industry standards.
  • Provide problem-solving and ramp support through data analytics, systemic issue resolution, and equipment startup for new technologies. 

Job Requirements

  • Education: Bachelor's degree in engineering or related field; postgraduate qualification is an advantage. 
  • Experience: Min 7 years in semiconductor assembly, packaging, or equipment engineering. 
  • Leadership: Proven experience in equipment management and team leadership, with a strong track record in analysis, problem solving, and performance improvement.
  • Skills: Exposure to automation, AI, or digital transformation initiatives is an added advantage.