Job Description
- Optimize wafer bump operations by ensuring smooth production flow, improved yields, and uncompromising quality standards.
- Enhance equipment performance through targeted projects that reduce costs, shorten cycle times, and eliminate defects.
- Drive process innovation by validating, upgrading, and fine-tuning wafer bump programs, parameters and specifications.
- Strengthen reliability systems by implementing preventive maintenance frameworks and statistical monitoring to meet industry compliance.
- Lead technical problem-solving with data-driven analysis, systemic issue resolution, and equipment ramp-up for new technologies.
Job Requirements
- Education: Bachelor's degree in engineering or a related discipline; postgraduate studies are considered an advantage.
- Experience: Min 7 years in semiconductor assembly, packaging, or wafer bump process engineering, with proven exposure to high- volume manufacturing environments.
- Technical skills: Familiarity with automation systems, AI applications, or digital transformation initiatives is highly desirable.
- Leadership: Demonstrated ability to lead process engineering teams and manage equipment operations, backed by a strong record of analytical problem-solving and driving measurable performance improvements.
