Job Description

  • Support manufacturing operations and ensure smooth production flow.
  • Develop and implement improvements in manufacturing methods, procedures, and efficiencies.
  • Create automated die attach programs and optimize process parameters with recipe standardization.
  • Manage die attach processes for flip chip packages and customer deliverables.
  • Document process details in specifications and work instructions.
  • Define die attach materials for specific applications (flux, solder paste, bumps, etc.).
  • Establish statistical and automated monitoring methods for process control.
  • Support reflow and flux wash processes including recipe generation and monitoring.
  • Implement improvement projects covering efficiency, cost reduction, quality, and automation.
  • Identify and resolve process issues related to equipment or procedures.
  • Support manufacturing ramp-up with equipment startup and process experiments.
  • Supervise and lead process technicians.

Job Requirements

  • Bachelor’s degree in Engineering or related fields (Chemical, Electrical, Mechanical, Materials Science, Physics, etc.).
  • Minimum 5 years of flip chip process experience.
  • Knowledge in ASM Die Bonder machines setup and optimization (ASM 8312+, ITEC ADAT).
  • Familiarity with reflow and flux wash processes.
  • Experience using statistical analysis tools (Excel, Minitab, Spotfire, JMP).
  • Understanding of quality tools (FTA, Fish Bone) and problem-solving methods (8D, RCA, DMAIC).
  • Prior hands-on experience in flip chip die attach, reflow, and flux wash is an advantage.